Dicing saw

Dicing saw is used to cut wafers into chips for further processing. The facility is equipped with a MicroAutomation 1006 Dicing saw with the following features:

• Microprocessor controlled and fully programmable.
• Accepts wafers up to 6" in diameter.
• Video monitor for easy alignment.
• Can cut a variety of materials such as Silicon, Lithium Niobate, glass, sapphire, etc.